胶黏剂，CORFIL® 625-1对比胶黏剂，CORFIL® 615物性表,价格行情_搜料

牌号信息	CORFIL® 625-1 物性表胶黏剂 & 美国氰特指导价格：暂无塑料库存：缺货	CORFIL® 615 物性表胶黏剂 & 美国氰特指导价格：暂无塑料库存：缺货
牌号简介	CORFIL® 625-1封装化合物是一种单组分低密度材料，用于蜂窝芯的插入和边缘填充。也可用作句法芯接头粘合剂。它具有低粘度，特别适用于自动化设备。CORFIL® 625-1可在250°F（121°C）或350°F（177°C）下固化，在大型应用中具有最低至无发热。特点和优点：一部分泵送材料250°F（121°C）/350°F（177°C）固化，最低放热温度-67至350°F（-55至177°C）工作范围 CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. FEATURES & BENEFITS One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range	CORFIL® 615封装化合物是一种低密度化合物，用作蜂窝夹层结构中的插入物或边缘填充材料。加入固化剂后，CORFIL® 615仍然是一种厚实的糊状物，放置在所需的结构中时，不会以自身重量运行。这种触变性能非常方便，因为它在固化期间不需要模具或其他包含装置。在CORFIL® 615固化后，它将能够承受随后高达350°F（177°C）的温度，而不会变成液体或以其他方式影响其作为结构材料的使用。三种固化剂可用于将封装化合物固化成坚硬的刚性材料。它们是：用于高温固化的固化剂“Z”；用于120°F（49°C）固化的固化剂“A”；以及用于室温固化的固化剂“DTA”。 CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent "Z" for curing at elevated temperature; Curing Agent "A" for curing at 120°F (49°C); and Curing Agent "DTA" for curing at ambient temperature.

产品描述
厂家：	美国氰特 Cytec Industries	美国氰特 Cytec Industries
类别：	胶黏剂胶黏剂	胶黏剂胶黏剂
填料：
用途：	填充应用,粘合剂,构件	构件,粘合剂,填充应用
性能特点：	低粘度,触变 Low Viscosity,Thixotropic	触变,耐高温,粘结性好,低密度 Thixotropic,High Heat Resistance,Good bond,Low density
加工条件：	灌封	灌封