公司信息及水印
牌号简介 About |
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APTIV® 2000系列薄膜是由Victrex Peek聚合物制成的未填充非晶态薄膜。该薄膜为超高性能应用的工程师提供了一种材料解决方案。APTIV薄膜是一系列功能广泛、高性能的薄膜,使用它可以降低系统成本、提高性能和增强设计自由度。APTIV® 2000具有独特的性能组合,提供高温性能、重量轻、机械强度、耐用性、优异的辐射、水解和耐化学性、电绝缘、耐磨损性、高纯度的优异阻隔性能、不使用阻燃剂的良好易燃性、低成本、低成本、低成本、低成本、低成本、低成本、低成本等特点。W燃烧产物的毒性和薄膜形式的低吸湿性。固有的无卤素和易加工性使APTIV薄膜成为我们客户和最终用户的技术推动者。请注意-APTIV® 2000将结晶,如果采取以上的TG(143°C,289°F)在二次过程或最终用途应用。如果不重新熔化材料,结晶就不可逆地回到非晶态。如果选择APTIV® 2000,则需要考虑加工和最终用途应用过程中的温度范围。 APTIV® 2000 series films are the unfilled amorphous films made from VICTREX® PEEK™ polymer. The film provides a material solution for engineers in ultra-high performance applications. APTIV films are a comprehensive range of versatile, high-performance films, the use of which can facilitate reduced systems costs, improved performance and enhanced design freedom. APTIV 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler for our customers and end users. Please note - APTIV 2000 will crystallize if taken above the Tg (143°C, 289°F) in either secondary processes or end use application. The crystallization is not reversible back to the amorphous phase without re-melting the material. Consideration of the temperature range during processing and end use application needs to be included if selecting APTIV 2000. |
技术参数 Technical Data | |||
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物理性能 PHYSICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
密度 Density Density |
1.26 | g/cm³ | ISO 1183 |
吸水率 Water Absorption Water Absorption |
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平衡 equilibrium,23℃,50% RH,0.05 mm Equilibrium balanced, 23 ℃, 50% RH, 0.05 mm |
0.21 | % | ISO 62 |
成型收缩率 Molding Shrinkage Molding shrinkage |
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MD:200℃,50.0 µm MD:200℃,50.0 µm |
< 10 | % | |
TD:200℃,50.0 µm TD:200℃,50.0 µm |
< 5.0 | % | |
机械性能 MECHANICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
薄膜厚度 film thickness Film thickness |
6 to 300 µm | ||
拉伸模量 Tensile Modulus Tensile Modulus |
ISO 527-3 | ||
MD,23℃,25 µm MD,23℃,25 µm |
MPa | ISO 527-3 | |
TD,23℃,25 µm TD,23℃,25 µm |
MPa | ISO 527-3 | |
MD,23℃,50 µm MD,23℃,50 µm |
MPa | ISO 527-3 | |
TD,23℃,50 µm TD,23℃,50 µm |
MPa | ISO 527-3 | |
MD,23℃,100 µm MD,23℃,100 µm |
MPa | ISO 527-3 | |
TD,23℃,100 µm TD,23℃,100 µm |
MPa | ISO 527-3 | |
拉伸强度 Tensile Strength Tensile Strength |
ISO 527-3 | ||
MD,断裂 brk,23℃,25 µm MD, fracture BRK, 23 ℃, 25 µ m |
MPa | ISO 527-3 | |
TD,断裂 brk,23℃,25 µm TD, fracture BRK, 23 ℃, 25 µ m |
MPa | ISO 527-3 | |
MD,断裂 brk,23℃,50 µm MD, fracture BRK, 23 ℃, 50 µ m |
MPa | ISO 527-3 | |
TD,断裂 brk,23℃,50 µm TD, fracture BRK, 23 ℃, 50 µ m |
MPa | ISO 527-3 | |
MD,断裂 brk,23℃,100 µm MD, fracture BRK, 23 ℃, 100 µ m |
MPa | ISO 527-3 | |
TD,断裂 brk,23℃,100 µm TD, fracture BRK, 23 ℃, 100 µ m |
MPa | ISO 527-3 | |
拉伸应变 Tensile Strain Tensile Strain |
ISO 527-3 | ||
MD,断裂 brk,23℃,25 µm MD, fracture BRK, 23 ℃, 25 µ m |
% | ISO 527-3 | |
TD,断裂 brk,23℃,25 µm TD, fracture BRK, 23 ℃, 25 µ m |
% | ISO 527-3 | |
MD,断裂 brk,23℃,50 µm MD, fracture BRK, 23 ℃, 50 µ m |
% | ISO 527-3 | |
TD,断裂 brk,23℃,50 µm TD, fracture BRK, 23 ℃, 50 µ m |
% | ISO 527-3 | |
MD,断裂 brk,23℃,100 µm MD, fracture BRK, 23 ℃, 100 µ m |
% | ISO 527-3 | |
TD,断裂 brk,23℃,100 µm TD, fracture BRK, 23 ℃, 100 µ m |
% | ISO 527-3 | |
裤型撕裂耐性 Pant shape tear resistance Pant shape tear resistance |
ISO 6383-1 | ||
MD:50 µm MD:50 µm |
N/mm | ISO 6383-1 | |
TD:50 µm TD:50 µm |
N/mm | ISO 6383-1 | |
热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
结晶峰温 Crystallization peak temperature Crystallization peak temperature |
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DSC DSC |
℃ | ||
线性热膨胀系数 Coeff.of linear therm expansion Coeff. of linear thermal expansion |
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MD:0.05 mm MD:0.05 mm |
1/℃ | ASTM D696 | |
电气性能 ELECTRICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
体积电阻率 Volume Resistivity Volume Resistance |
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23 ℃,0.05 mm 23 ℃,0.05 mm |
ohms·cm | ASTM D257 | |
介电强度 Dielectric Strength Dielectric Strength |
ASTM D149 | ||
23 ℃,0.025 mm 23 ℃,0.025 mm |
kV/mm | ASTM D149 | |
23 ℃,0.05 mm 23 ℃,0.05 mm |
kV/mm | ASTM D149 | |
23 ℃,0.1 mm 23 ℃,0.1 mm |
kV/mm | ASTM D149 | |
介电常数 Dielectric Constant Dielectric Constant |
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23 ℃,0.05 mm,10 MHz 23 ℃,0.05 mm,10 MHz |
ASTM D150 | ||
耗散因数 Dissipation Factor Dissipation Factor |
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23℃,0.05 mm,10 MHz 23℃,0.05 mm,10 MHz |
ASTM D150 | ||
击穿电压 breakdown voltage Breakdown voltage |
ASTM D149 | ||
23℃,25.0 µm 23℃,25.0 µm |
V | ASTM D149 | |
23℃,50.0 µm 23℃,50.0 µm |
V | ASTM D149 | |
23℃,125.0 µm 23℃,125.0 µm |
V | ASTM D149 | |
补充信息 Supplementary Information |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
抗穿刺性 Puncture Resistance Puncture Resistance |
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23℃,50.0 µm 23℃,50.0 µm |
kJ/m² | 内部方法 |
备注 |
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1 一般属性:这些不能被视为规格。 |
2 24 hrs |
3 TM-VX-84 |
4 23°C |
5 below Tg |
6 100 V |
7 6.35 mm electrode |
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