公司信息及水印
牌号简介 About |
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Tecasint 2000系列聚酰亚胺浆料形状提供了高温、轴承和磨损的优良组合,使其成为最苛刻应用的理想选择。TECASINT™ 2011非常纯净,排气量低。它还具有长期的热稳定性、出色的耐磨性、高的蠕变阻力和强度,可连续使用温度达到536°F。Tecasint 2021含有15%的石墨,也可用于需要提高耐磨性和降低摩擦系数的应用。Tecasin 2000系列具有优异的物理性能,是航空航天、核、汽车、电气/电子和化学加工行业的理想应用。Tecasint形状是半导体加工行业中高纯度应用的理想选择。Tecasint应用生产的典型组件包括运输/非公路设备中的密封件、止推垫圈、衬套和耐磨垫、电气焊接和铜焊设备中的绝缘和支撑元件以及半导体等离子炉恶劣环境中的晶片处理组件。泵和阀门密封件、叶片和活塞环也通常由Tecasint系列材料制成。 TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it's longterm thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction. TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials. Superior high temperature characteristics Excellent long-term thermal stability Outstanding bearing and wear properties Excellent creep resistance High strength and stiffness properties High purity characteristics Good chemical resistance |
技术参数 Technical Data | |||
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物理性能 PHYSICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
密度 Density |
1.38 | g/cm³ | ASTM D792 |
吸水率 Water absorption rate |
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23℃,24hr 23℃,24hr |
0.24 | % | ASTM D570 |
冲击性能 IMPACT |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
简支梁缺口冲击强度 Charpy Notched Impact Strength |
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23℃ 23℃ |
2230 | J/m | ASTM D256 |
热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
热变形温度 Hot deformation temperature |
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1.8 MPa,未退火 1.8 MPa, unannealed |
> 316 | ℃ | ASTM D648 |
线性热膨胀系数 Linear coefficient of thermal expansion |
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MD:-40~38℃ MD:-40~38℃ |
5.4E-5 | 1/℃ | ASTM D696 |
比热 specific heat |
J/kg/℃ | ASTM E1269 | |
导热系数 Thermal conductivity coefficient |
W/m/K | ASTM C177 | |
最高使用温度 Maximum operating temperature |
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Intermittent Intermittent |
℃ | ||
长期 long-term |
℃ | ||
电气性能 Electrical performance |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
表面电阻率 Surface resistivity |
ohms | ASTM D257 | |
体积电阻率 Volume resistivity |
ohms·cm | ASTM D257 | |
介电强度 Dielectric strength |
kV/mm | ASTM D149 | |
介电常数 Dielectric constant 2 |
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23 ℃,1 MHz 23 ℃,1 MHz 2 |
ASTM D150 | ||
耗散因数 Dissipation factor |
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23℃,60 Hz 23℃,60 Hz |
ASTM D150 | ||
机械性能 MECHANICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
邵氏硬度 Shore hardness |
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邵氏 D Shaw's D |
ASTM D2240 | ||
洛氏硬度 Rockwell hardness |
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E 级,23℃ Grade E, 23 ℃ |
ASTM D785 | ||
拉伸模量 Tensile modulus |
MPa | ASTM D638 | |
拉伸强度 tensile strength |
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屈服,23℃ Yield, 23 ℃ |
MPa | ASTM D638 | |
拉伸应变 Tensile strain |
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断裂,23℃ Fracture, 23 ℃ |
% | ASTM D638 | |
弯曲模量 Bending modulus |
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23℃ 23℃ |
MPa | ASTM D790 | |
弯曲强度 bending strength |
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23℃ 23℃ |
MPa | ASTM D790 |
备注 |
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1 一般属性:这些不能被视为规格。 |
2 50% RH |
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