环氧树脂，Plaskon SMT-B-1NLV对比环氧树脂，Plaskon SMT-B-1N物性表,价格行情_搜料

牌号信息	Plaskon SMT-B-1NLV 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货	Plaskon SMT-B-1N 物性表环氧树脂 & 美国Cookson Electronics 指导价格：暂无塑料库存：缺货
牌号简介	这种材料是一种专为PBGA应用而优化的环氧成型化合物，成型前无需等离子清洗。它具有与SMT-B-1相同的独特树脂系统，可最大限度地减少翘曲，并可在刚性和柔性层压基板上实现无故障成型。成型后、烘烤后和随后的焊料处理后的最小尺寸变化使该化合物成为PBGA和CSP应用的最佳选择。 This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.	这种材料是一种专为PBGA应用而优化的环氧成型化合物，成型前无需等离子清洗。它具有与SMT-B-1相同的独特树脂系统，可最大限度地减少翘曲，并可在刚性和柔性层压基板上实现无故障成型。成型后、烘烤后和随后的焊料处理后的最小尺寸变化使该化合物成为PBGA和CSP应用的最佳选择。 This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications.

产品描述
厂家：	美国Cookson Electronics	美国Cookson Electronics
类别：	环氧树脂环氧树脂	环氧树脂环氧树脂
填料：
用途：
性能特点：	低翘曲性,尺寸稳定性好,导电,低粘度,快速固化,防火阻燃等级V-0 Low warping,Good Dimensional Stability,Conductive,Low Viscosity,Fast Cure,V-0	低翘曲性,尺寸稳定性好,导电,低粘度,快速固化,防火阻燃等级V-0 Low warping,Good Dimensional Stability,Conductive,Low Viscosity,Fast Cure,V-0
加工条件：	树脂传递成型	树脂传递成型