环氧树脂，KYOCERA KE-1150对比环氧树脂，KYOCERA KE-200DH物性表,价格行情_搜料

牌号信息	KYOCERA KE-1150 物性表环氧树脂 & 日本京瓷指导价格：暂无塑料库存：缺货	KYOCERA KE-200DH 物性表环氧树脂 & 日本京瓷指导价格：暂无塑料库存：缺货
牌号简介	EVA树脂Alcudia PA-442适用于低粘度热熔胶粘剂，可与各种粘树脂和蜡相容。它含有抗氧化剂和自由流动剂。典型应用热熔胶包装装订建议熔化温度低于200°C，以避免聚合物分解。各生产线的加工条件应得到优化。 Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package Strong Points Less Warpage in All Types of Area Array Packages due to High Tg Characteristic. Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance. Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP. Application Standard P-BGA, HS-BGA and LGA Package. Multi Chip Module (Stacked or Side by Side Layout) IC Card, Memory Card etc. Low Alpha Ray Type: KE-2150	我们有几种不同等级的化合物，成本和性能之间有良好的平衡，以满足客户的广泛要求。优点：即使在高温回流焊接过程中，也具有良好的附着强度。达到良好的再流阻力（jedec 2级），具有良好的可塑性。JEDEC 1级，以防可能出现较小的包装。排列多个引线框架类型。（铜，42合金，镀钯/金）应用SOP，较大的QFP，较小的QFP，DIP，TO-PKG，DPAK，SOT We have several grades of compounds w/good balance between cost and performance to meet wide requirements of customers. Strong Points Good Adhesion Strength even Under High Temperature Reflow Soldering Process. Achieve Good Reflow Resistance (JEDEC Level 2) with Good Moldability. JEDEC Level 1 in Case Smaller Package is possible. Line Up for Several Lead Frame Types. (Cu,42Alloy,Pd/Au plated) Application SOP, Larger QFP, Smaller QFP, DIP, TO-PKG, DPAK, SOT

产品描述
厂家：	日本京瓷 KYOCERA	日本京瓷 KYOCERA
类别：	环氧树脂环氧树脂	环氧树脂环氧树脂
填料：
用途：	包装,粘合剂	电气/电子应用领域
性能特点：	低粘度,食品接触,抗氧化 Low Viscosity,Food contact compliance,Inoxidizability	易加工,粘结性好 Excellent Processability,Good bond
加工条件：