特殊弹性体，Kimura® K13X对比特殊弹性体，Kimura® K23X物性表,价格行情_搜料

牌号信息	Kimura® K13X 物性表特殊弹性体 & 英国Precision 指导价格：暂无塑料库存：缺货	Kimura® K23X 物性表特殊弹性体 & 英国Precision 指导价格：暂无塑料库存：缺货
牌号简介	一种深棕色高性能聚合物，含有独特的自增强聚合物结构，专门为关键半导体应用而开发。高纯度的聚合物加上不含任何填料，使得这种聚合物适用于涉及较低特征尺寸的工艺。这种材料的热膨胀系数低，压缩永久变形小，在腐蚀性等离子体环境中腐蚀率极低。关键属性非常纯净-不包含任何可能导致颗粒问题的填料。优异的抗等离子体性能-适用于氯、氟和氧化学。极低的等离子刻蚀速率、低的热膨胀回复适合现有的O型环槽（包括FKM和FFKM槽）、低渗透、低出气、低粘附（减少粘着力）、低摩擦、高强度和高模量，使K13X成为恒力动态应用的理想选择。典型应用动态密封静密封晶片搬运产品 A dark brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for critical semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments. Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Low friction, high strength and high modulus make K13X ideal for constant force dynamic applications. Typical Applications Dynamic seals Static seals Wafer-handling products	一种棕色高性能聚合物，含有独特的自增强聚合物结构，专门为侵略性半导体应用而开发。高纯度的聚合物加上不含任何填料，使得这种聚合物适用于涉及较低特征尺寸的工艺。这种材料的热膨胀系数低，压缩永久变形小，在腐蚀性等离子体环境中腐蚀率极低。Kimura® K23X可完全铸造成定制形状和O型环（从6.07mm/0.24“ID和1.78mm/0.07”CS到600 mm/23.6“ID和10 mm/0.39”CS）。关键属性非常纯净-不包含任何可能导致颗粒问题的填料。低模量确保优良的密封特性，优异的抗等离子体性能-是氯、氟和氧化学的理想选择。极低的等离子刻蚀率、低热膨胀回复适合现有的O型环槽（包括FKM和FFKM槽）低渗透、低出气、低粘附性（减少粘附）典型应用动态密封、静态密封、晶片处理产品 A brown coloured high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments. Kimura® K23X can be fully moulded into custom shapes and O-rings (from 6.07mm/0.24" ID & 1.78mm/0.07" CS up to 600mm/23.6" ID & 10mm/0.39" CS). Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Low modulus ensures excellent sealing characteristics Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products

产品描述
厂家：	英国Precision	英国Precision
类别：	特殊弹性体特殊弹性体	特殊弹性体特殊弹性体
填料：
用途：	密封件,配件,阀门/阀门部件,电气/电子应用领域	密封件,电气/电子应用领域,配件,阀门/阀门部件
性能特点：	机械强度好,热膨胀系数低,高纯度,尺寸稳定性好,低摩擦系数,低VOC Good Rigidity,Low CLTE,High purity,Good Dimensional Stability,Low coefficient of friction,Low odor	热膨胀系数低,高纯度,低VOC Low CLTE,High purity,Low odor
加工条件：