胶黏剂，FM® 6555-1对比胶黏剂，CORFIL® 615物性表,价格行情_搜料

牌号信息	FM® 6555-1 物性表胶黏剂 & 美国氰特指导价格：暂无塑料库存：缺货	CORFIL® 615 物性表胶黏剂 & 美国氰特指导价格：暂无塑料库存：缺货
牌号简介	FM® 6555-1是氰酸酯句法的核心材料。在制造用于低介电应用和卫星结构的薄的、刚度关键的复合板时，它被设计成一种节省成本和重量的替代品。FM® 6555-1句法核心是基于Cycom 5575-2玻璃和石英氰酸酯预浸料、FM 2555和FM 2525结构膜粘合剂和FM 313-27C句法膏，提供了一个兼容的产品系列。FM® 6555-1可用于板材或辊型（辊型的可用性取决于产品厚度）。建议应用：用于低介电应用和空间结构的薄复合板，其重量和/或成本至关重要。 FM® 6555-1 is a cyanate ester syntactic core material. It was designed as a cost and weight saving alternative in the manufacture of thin, stiffness critical composite panels for low dielectric applications and satellite structures. FM 6555-1 syntactic core is based on CYCOM® 5575-2 glass and quartz cyanate ester prepregs, FM 2555 and FM 2525 structural film adhesives and FM 313-27C syntactic paste, providing a compatible family of products. FM 6555-1 is available in sheet or roll form (availability in roll form is dependent on product thickness). Suggested Applications: Thin composite panels for low dielectric applications and space structures where weight and/or cost are critical	CORFIL® 615封装化合物是一种低密度化合物，用作蜂窝夹层结构中的插入物或边缘填充材料。加入固化剂后，CORFIL® 615仍然是一种厚实的糊状物，放置在所需的结构中时，不会以自身重量运行。这种触变性能非常方便，因为它在固化期间不需要模具或其他包含装置。在CORFIL® 615固化后，它将能够承受随后高达350°F（177°C）的温度，而不会变成液体或以其他方式影响其作为结构材料的使用。三种固化剂可用于将封装化合物固化成坚硬的刚性材料。它们是：用于高温固化的固化剂“Z”；用于120°F（49°C）固化的固化剂“A”；以及用于室温固化的固化剂“DTA”。 CORFIL® 615 potting compound is a low density compound for use as insert or edge filling material in honeycomb sandwich construction. After the curing agent is added, CORFIL 615 remains a thick paste which will not run of its own weight when placed in the desired construction. This thixotropic property is highly convenient because it eliminates the need for molds or other containing devices during the curing period. After CORFIL 615 is cured it will withstand subsequent temperatures up to 350°F (177°C) without becoming fluid or otherwise impairing its use as a structural material. Three curing agents are available to cure the potting compound to a hard, rigid material. These are: Curing Agent "Z" for curing at elevated temperature; Curing Agent "A" for curing at 120°F (49°C); and Curing Agent "DTA" for curing at ambient temperature.

产品描述
厂家：	美国氰特 Cytec Industries	美国氰特 Cytec Industries
类别：	胶黏剂胶黏剂	胶黏剂胶黏剂
填料：
用途：	增强面板,粘合剂	构件,粘合剂,填充应用
性能特点：	机械强度好,粘结性好 Good Rigidity,Good bond	触变,耐高温,粘结性好,低密度 Thixotropic,High Heat Resistance,Good bond,Low density
加工条件：	热成型 Thermo forming	灌封