PI，FM® 50对比PI，SKYBOND® 2601物性表,价格行情_搜料

牌号信息	FM® 50 物性表 PI & 美国氰特指导价格：暂无塑料库存：缺货	SKYBOND® 2601 物性表 PI & 美国Industrial Summit 指导价格：暂无塑料库存：缺货
牌号简介	FM® 50是一种非MDA基聚酰亚胺泡沫材料，用于核心拼接应用，需要500至600°F（260至316°C）的服务。FM® 50可用自由或受限发泡工艺就地固化。它不含金属填料。建议应用：高温芯接头和边缘密封应用 FM® 50 is a non-MDA-based polyimide foam material intended for core-splicing applications requiring 500 - 600°F (260 - 316°C) service. FM 50 may be cured in place with either a free or restrained foaming process. It contains no metallic fillers. Suggested Applications: High temperature core splice and edge sealing applications	Skybond产品线包括许多可用作制造高热稳定性结构复合材料的基体树脂的产品。基于Skybond树脂系列的复合材料连续使用温度超过600°F，短期性能超过1000°F。预浸料已成功地从所有常见的高性能基板（如E玻璃、高模量碳和石英）制造。Skybond家族开发了两种新型的基体树脂。第一种可以通过RTM成型技术进行加工，使聚酰亚胺树脂具有优异的耐热性。第二类新的Skybond基体树脂是两级固化树脂，当用于预浸料应用时，通过高压釜处理（<0.5%空隙率）结合良好的聚酰亚胺树脂热稳定性来制造极低空隙率的复合材料。 The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins.

产品描述
厂家：	美国氰特 Cytec Industries	美国Industrial Summit
类别：	PI PI	PI PI
填料：
用途：	粘合剂,密封剂,泡沫	复合
性能特点：	耐高温,热稳定性好 High Heat Resistance,Heat Stabilized	热稳定性好 Heat Stabilized
加工条件：	泡沫处理 Foam treatment