PI，Pyre-ML® RC-5057对比PI，SKYBOND® 2601物性表,价格行情_搜料

牌号信息	Pyre-ML® RC-5057 物性表 PI & 美国Industrial Summit 指导价格：暂无塑料库存：缺货	SKYBOND® 2601 物性表 PI & 美国Industrial Summit 指导价格：暂无塑料库存：缺货
牌号简介	PyreML生产线包括一系列用于磁线绝缘的瓷釉。基于Pyre-ML搪瓷的绝缘线具有NEMA最高的240°C连续使用温度。除具有很高的热额定值外，用PyreML瓷漆绝缘的电线还具有很好的柔韧性和优异的耐溶剂性。这种出色的性能组合使Pyre-ML绝缘成为40多年来最苛刻的磁线应用的选择。为了满足客户近年来的强烈需求，我们在该系列中增加了一些产品，例如更高固体含量的产品，可以更有效地制造磁丝。我们实验室开发的这些新的高固体含量产品已被许多磁铁线制造商使用，并通过提高生产率获得了良好的声誉。 The Pyre ML® product line encompasses a family of enamels employed in insulation of magnet wire. The insulated wire based on Pyre ML® enamel has the highest thermal rating of 240° C continuous use temperature from NEMA. In addition to its very high thermal rating, wire insulated with Pyre ML® enamel has very good flexibility and excellent solvent resistance. This outstanding combination of properties has made Pyre ML® insulation the choice for the most demanding magnet wire applications for over four decades. To fulfill customers strong demands in recent years, we have made additions to the family, such as higher solids level products that allow more efficient manufacture of magnet wires. These new high solids level products developed by our lab have been used by many magnet wire manufacturers and acquired excellent reputations by increasing their productivity.	Skybond产品线包括许多可用作制造高热稳定性结构复合材料的基体树脂的产品。基于Skybond树脂系列的复合材料连续使用温度超过600°F，短期性能超过1000°F。预浸料已成功地从所有常见的高性能基板（如E玻璃、高模量碳和石英）制造。Skybond家族开发了两种新型的基体树脂。第一种可以通过RTM成型技术进行加工，使聚酰亚胺树脂具有优异的耐热性。第二类新的Skybond基体树脂是两级固化树脂，当用于预浸料应用时，通过高压釜处理（<0.5%空隙率）结合良好的聚酰亚胺树脂热稳定性来制造极低空隙率的复合材料。 The Skybond® product line encompasses a number of products usable as matrix resins for manufacture of high thermal stability structural composites. Composites based on the Skybond® family of resins have continuous use temperatures in excess of 600° F with short term capability greater than 1000° F. Prepreg has been successfully manufactured from all common high performance substrates, such as, E-glass, high modulus carbon, and quartz. Two new classes of matrix resins have been developed in the Skybond® family. The first can be processed by RTM molding techniques to bring the outstanding thermal resistance of polyimide resins to RTM molded composites. The second new class of Skybond® matrix resins is the two-stage cure resins that when used in prepreg applications allow the manufacture of very low void level composites by autoclave processing (<0.5% voids) combined with excellent thermal stability of polyimide resins.

产品描述
厂家：	美国Industrial Summit	美国Industrial Summit
类别：	PI PI	PI PI
填料：
用途：	电缆护套,电线电缆应用	复合
性能特点：	韧性好,耐化学性,热稳定性好 Good flexibility,Solvent resistance,Heat Stabilized	热稳定性好 Heat Stabilized
加工条件：