CONAP® CE-1170
SMMA & 美国氰特
CONAP® CE-1171
SMMA & 美国氰特
牌号信息 |
SMMA & 美国氰特 指导价格:暂无 塑料库存: 缺货 |
SMMA & 美国氰特 指导价格:暂无 塑料库存: 缺货 |
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牌号简介 |
CONAP® CE-1170是一种单组分空气干燥室温固化丙烯酸保形涂料,符合MIL-I-46058-C中有关AR型涂料的要求。CONAP® CE-1170是一种溶剂型涂料,设计用于元件和印刷电路的薄膜应用。它是专为其快速干燥时间和可修复性,以及提供耐湿性和水解稳定性,同时保持良好的灵活性,以防止易碎部件在热循环破裂而开发的。其电性能优异。即使在不利的环境条件下,固化膜也能保持对酚醛和环氧玻璃层压板的良好粘附力。可通过用烙铁加热涂层来去除部件,或用合适的溶剂去除整个涂层。已经加入了一种示踪染料,以帮助在紫外线下进行检查。 CONAP CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light. |
CONAP® CE-1171是一种单组分丙烯酸保形涂料,其配方符合规则66豁免溶剂的规定,并符合MIL-I-46058C对AR型涂料的最新要求。CONAP® CE-1171设计用于元件和印刷电路的薄膜应用。它是专为其快速干燥时间和可修复性,并提供最终的抗湿性和水解稳定性。CONAP® CE-1171保持了良好的灵活性,以防止易碎部件在热循环过程中破裂。电气性能优异。即使在不利的环境条件下,固化膜也能保持对酚醛和环氧玻璃层压板的良好粘附力。可通过使用烙铁熔化涂层来去除部件,或使用合适的溶剂去除整个涂层。已经加入了一种示踪染料,以帮助在紫外线下进行检查。 CONAP CE-1171 is a single-component acrylic conformal coating that has been formulated in Rule 66 exempt solvents and meets the latest requirements of MIL-I-46058C for Type AR coatings. CONAP CE-1171 is designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability and to provide the ultimate in humidity resistance and hydrolytic stability. CONAP CE-1171 retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Components may be removed by melting through the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultra-violet light. |
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产品描述 | |||
厂家: | 美国氰特 Cytec Industries | 美国氰特 Cytec Industries | |
类别: | SMMA SMMA | SMMA SMMA | |
填料: | |||
用途: | 涂层应用,薄膜,电气/电子应用领域 | 薄膜,涂层应用,电气/电子应用领域 | |
性能特点: | 韧性好,电气性好,耐水解,细菌阻隔,无卤,防潮 Good flexibility,Good Electrical Properties,Hydrolysis stability,Antimicrobial properties,Halogen free,Moisture resistance | 韧性好,电气性好,耐水解,细菌阻隔,无卤,防潮 Good flexibility,Good Electrical Properties,Hydrolysis stability,Antimicrobial properties,Halogen free,Moisture resistance | |
加工条件: |
备注 |
2 Initially and 50% R.H.
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2 Initially and 50% R.H.
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价格走势对比图
SMMA CONAP® CE-1170
SMMA CONAP® CE-1171
型号 | 类别 | 厂家 | 产地 | 颜色 | 首期使用量 | 后期使用量 | 包装 | 交期 | 成型产品 | 操作 |
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GP-525N | GPPS | VATAA土耳其地区 | 亚太地区 | 天 |
单据状态:未提交