SMMA，CONAP® CE-2290对比SMMA，CONAP® CE-1170物性表,价格行情_搜料

牌号信息	CONAP® CE-2290 物性表 SMMA & 美国氰特指导价格：暂无塑料库存：缺货	CONAP® CE-1170 物性表 SMMA & 美国氰特指导价格：暂无塑料库存：缺货
牌号简介	CONAP® CE-2290是一种单组分丙烯酸保形涂料，由非石油基生物衍生溶剂配制而成。该产品在MIL-I-46058C的合格产品清单（QPL）中，并经IPC-CC-830B批准用于AR型涂层。CONAP® CE-2290的溶剂部分是EPA批准的不含消耗臭氧层化学物质的SNAP成分。它是非致癌的，不含HAPS，是非SARA报告。CONAP® CE-2290设计用于元件和印刷电路的薄膜应用。它提供快速干燥时间，可修复性，出色的耐湿性和水解稳定性。CONAP® CE-2290具有优异的电气性能，并保持良好的灵活性，以防止易碎部件在热循环过程中破裂。即使在不利的环境条件下，固化膜也能保持对酚醛和环氧玻璃层压板的良好粘附力。用烙铁熔化涂层可以去除部件。使用合适的溶剂可以去除整个涂层。CONAP® CE-2290含有一种示踪染料，以帮助在紫外线下进行检查。 CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable. CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.	CONAP® CE-1170是一种单组分空气干燥室温固化丙烯酸保形涂料，符合MIL-I-46058-C中有关AR型涂料的要求。CONAP® CE-1170是一种溶剂型涂料，设计用于元件和印刷电路的薄膜应用。它是专为其快速干燥时间和可修复性，以及提供耐湿性和水解稳定性，同时保持良好的灵活性，以防止易碎部件在热循环破裂而开发的。其电性能优异。即使在不利的环境条件下，固化膜也能保持对酚醛和环氧玻璃层压板的良好粘附力。可通过用烙铁加热涂层来去除部件，或用合适的溶剂去除整个涂层。已经加入了一种示踪染料，以帮助在紫外线下进行检查。 CONAP CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light.

产品描述
厂家：	美国氰特 Cytec Industries	美国氰特 Cytec Industries
类别：	SMMA SMMA	SMMA SMMA
填料：
用途：	印刷电路板,半导体保护涂料,薄膜,涂层应用	涂层应用,薄膜,电气/电子应用领域
性能特点：	韧性好,电气性好,耐水解,粘结性好,防潮 Good flexibility,Good Electrical Properties,Hydrolysis stability,Good bond,Moisture resistance	韧性好,电气性好,耐水解,细菌阻隔,无卤,防潮 Good flexibility,Good Electrical Properties,Hydrolysis stability,Antimicrobial properties,Halogen free,Moisture resistance
加工条件：	涂层