PI，KYOCERA IMIDALLOY KIR-30对比PI，CYCOM® 2237物性表,价格行情_搜料

牌号信息	KYOCERA IMIDALLOY KIR-30 物性表 PI & 日本京瓷指导价格：暂无塑料库存：缺货	CYCOM® 2237 物性表 PI & 美国氰特指导价格：暂无塑料库存：缺货
牌号简介	“咪唑合金”KIR-30是最适合金刚石砂轮、摩擦材料等的结合剂，其优点是优良的耐热性、优良的粘附性、优良的可塑性、环保性，“咪唑合金”对有机材料具有优异的耐热性和粘附性。我们在磨轮方面有很多销售业绩。 "IMIDALLOY" KIR-30 is best suitable binder for Diamond grind wheel , Friction materials, etc. Strong Points Excellent Heat resistance Excellent Adhesion property Excellent Moldability Environmental friendly "IMIDALLOY" have Excellent Heat resistance and Excellent Adhesion property to organic material. We have a lot of sales performance in the grind wheel purpose.	CYCOM® 2237是赛特工程材料公司PMR-15的版本。它适用于低空隙率至关重要的高温应用。CYCOM® 2237在500至550°F（260至288°C）范围内具有最佳的加工行为、热氧化稳定性和性能保持的总体平衡。CYCOM® 2237的热氧稳定性和微裂纹阻力使其成为喷气发动机和其他疲劳加载部件的理想选择，如旁路管道、齿轮箱盖、变速箱壳、通风管、风扇定子和叶片总成、喷嘴襟翼、芯罩、颗粒分离器涡流框架和压模轴承。CYCOM® 2237预浸料可进行高压釜固化、真空袋处理或压缩成型。CYCOM® 2237是溶液浸渍在各种纤维和织物上。目前可用于玻璃、石英和石墨增强。产品形式有单向胶带、无纺布、无纺布。一般来说，UD胶带的宽度为12英寸，垫子为24英寸，机织物为60英寸。 CYCOM® 2237 is Cytec Engineered Materials' version of PMR-15. It is formulated for high temperature applications where low void content is critical. CYCOM 2237 has the best overall balance of processing behavior, thermo-oxidative stability and retention of properties in the 500 to 550°F (260 to 288°C) range. CYCOM 2237's thermo-oxidative stability and micro-crack resistance make it ideal for jet engine and other fatigue loaded components like bypass ducts, gear box covers, transmission housings, vent tubes, fan stator and vane assemblies, nozzle flaps, core cowls, particle separator swirl frames and compression molded bearings. CYCOM 2237 prepreg can be autoclave cured, vacuum bag processed or compression molded. CYCOM 2237 is solution impregnated on a variety of fibers and fabrics. It is currently available on glass, quartz and graphite reinforcement. Product forms are unidirectional tape, non-woven mate and woven fabrics. Generally available widths are 12 inches for UD tape, 24 inches for mat and 60 inches for woven fabrics.

产品描述
厂家：	日本京瓷 KYOCERA	美国氰特 Cytec Industries
类别：	PI PI	PI PI
填料：
用途：	电气/电子应用领域	构件,管件,轴承,航空航天应用
性能特点：	易加工,耐高温,粘结性好 Excellent Processability,High Heat Resistance,Good bond	耐高温,耐高压加热性 High Heat Resistance,High pressure heat resistance
加工条件：		真空成型