公司信息及水印
牌号简介 About |
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TECAPEEK® CMF的开发考虑到半导体后端测试应用的需求。由于测试插座等零件通常需要复杂的设计,TECAPEEK® CMF设计了陶瓷填料,使其尺寸非常稳定且可加工。它能抵抗加工过程中形成的毛边,不吸收水分,即使是最小的几何尺寸也能精确测量,无需二次去毛刺操作。TECAPEEK® CMF还可以在一定温度范围内保持稳定,同时保持良好的机械强度和刚度。TECAPEEK® CMF提供了非常适合半导体后端测试应用(如测试插座)的性能配置文件。该材料具有表面硬度和固有韧性以及尺寸稳定性和可加工性。良好的机械加工性,即使在最小尺寸也能形成低毛刺,即使在高温下也能产生良好的尺寸稳定性,在较宽的温度范围内,极低的吸湿性,良好的机械强度和刚度,即使在最小壁厚的情况下,也能最大限度地减少停机时间,从而防止材料开裂。锿 TECAPEEK CMF has been developed with demanding semiconductor back end testing applications in mind. Because of the often intricate designs necessary for parts such as test sockets, TECAPEEK CMF has been designed with ceramic fillers to be very dimensionally stable and machinable. It resists the formation of burrs during machining, and does not absorb moisture, allowing for accurate and precise dimensions of even the smallest geometries without the necessity of secondary de-burring operations. TECAPEEK CMF is also stable over a range of temperatures while maintaining good mechanical strength and stiffness. TECAPEEK CMF offers a property profile well suited to semiconductor back end test applications such as test sockets. The material exhibits surface hardness and inherent toughness along with dimensional stability and machinability. Excellent machinability with low burr formation even in the smallest dimensions Minimal CLTE resulting in good dimensional stability over a wide temperature range Very low moisture absorption Good mechanical strength and stiffness even at high temperatures minimizing downtime Tough enough to prevent material cracks even with minimal wall thicknesses |
技术参数 Technical Data | |||
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物理性能 PHYSICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
密度 Density |
1.63 | g/cm³ | ASTM D792 |
吸水率 Water absorption rate |
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23℃,24hr 23℃,24hr |
0.060 | % | ASTM D570 |
冲击性能 IMPACT |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
悬臂梁缺口冲击强度 Impact strength of cantilever beam notch |
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23℃ 23℃ |
35 | J/m | ASTM D256 |
热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
热变形温度 Hot deformation temperature |
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0.45 MPa,未退火 0.45 MPa, unannealed |
288 | ℃ | |
1.8 MPa,未退火 1.8 MPa, unannealed |
300 | ℃ | |
熔融温度 Melting temperature |
℃ | ||
线性热膨胀系数 Linear coefficient of thermal expansion |
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MD MD |
1/℃ | ASTM D696 | |
导热系数 Thermal conductivity coefficient |
W/m/K | ASTM C177 | |
使用温度 Operating temperature |
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Intermittent Intermittent |
℃ | ||
长期 long-term |
℃ | ||
电气性能 Electrical performance |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
表面电阻率 Surface resistivity |
ohms | ASTM D257 | |
体积电阻率 Volume resistivity |
ohms·cm | ASTM D257 | |
介电强度 Dielectric strength |
kV/mm | ASTM D149 | |
介电常数 Dielectric constant 2 |
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23 ℃,60 Hz 23 ℃,60 Hz 2 |
ASTM D150 | ||
耗散因数 Dissipation factor |
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23℃,60 Hz 23℃,60 Hz |
ASTM D150 | ||
阻燃性能 FLAME CHARACTERISTICS |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
阻燃等级 Flame retardant level |
UL 94 | ||
机械性能 MECHANICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
洛氏硬度 Rockwell hardness |
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M 级 M-level |
ASTM D785 | ||
拉伸模量 Tensile modulus |
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23℃ 23℃ |
MPa | ASTM D638 | |
拉伸强度 tensile strength |
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屈服,23℃ Yield, 23 ℃ |
MPa | ||
断裂,23℃ Fracture, 23 ℃ |
MPa | ||
拉伸应变 Tensile strain |
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屈服,23℃ Yield, 23 ℃ |
% | ||
断裂,23℃ Fracture, 23 ℃ |
% | ||
弯曲模量 Bending modulus |
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23℃ 23℃ |
MPa | ASTM D790 | |
弯曲强度 bending strength |
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23℃ 23℃ |
MPa | ASTM D790 | |
压缩模量 Compression modulus |
MPa | ASTM D695 | |
压缩强度 compressive strength |
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10% 应变,23℃ 10% strain, 23 ℃ |
MPa | ASTM D695 |
备注 |
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2. 50% RH |
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瑞典新技术,让塑料与细菌说再见!
2017-09-12 细菌通常会在所有的塑料工具上传播,也就是说,所有的塑料都可能藏着有害微生物。而这些细菌不仅能在塑料表面上存活很长一段时间,还很有可能因此扩散到接触到该物体的人身上。 为了让塑料变得「健康」,来自瑞典卡罗林 |
【免责声明】 广州搜料信息技术有限公司保留所有权利。 此数据表中的信息由搜料网soliao.com从该材料的生产商处获得。搜料网soliao.com尽最大努力确保此数据的准确性。 但是搜料公司对这些数据值及建议等给用户带来的不确定因素和后果不承担任何责任,并强烈建议在最终选择材料前,就数据值与材料供应商进行验证。 |