公司信息及水印
牌号简介 About |
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Techsil® RTV27844是一种透明液体,在室温下通过添加固化剂固化成高强度硅橡胶。RTV27844配备了配套套件中的固化剂,设计用于方便的10:1重量比。RTV27844是一种低粘度、易倾倒的液体。RTV27844硅橡胶化合物具有在低温下保持柔性的能力,并已用于通过封装或封装组件来保护电子元件和组件免受冲击、振动、湿气、臭氧、灰尘、化学品和其他环境危害。这种硅橡胶的光学透明性建议对诸如封装太阳能电池以实现最大透光率和电子组件等应用进行评估,在这些应用中,组件识别是必要的或可取的。主要特点和优点:方便的10:1混合比,用于自动分配或手动操作。低粘度使复杂部件易于流动,提供良好的电气绝缘和抗冲击固化速度,可通过在深部或封闭组件中进行热固化而加快固化速度,无需加热,且具有较低的表面粗糙度。冲洗化学成分不含溶剂,易于在生产线上使用,抗返原性和水解稳定性。允许在高温高湿度环境中使用。透明性允许目视检查,以便识别和修理封装部件。在温度高达20℃时,弹性体性能保持不变。4°C(400°F) Techsil RTV27844 is a clear liquid which will cure at room temperature to a high strength silicone rubber with the addition of curing agents. RTV27844 is supplied with a curing agent in matched kits which are designed for use at a convenient 10:1 ratio by weight. RTV27844 is a low viscosity, easily pourable liquid. RTV27844 silicone rubber compound has the capability of remaining flexible at low temperatures and have been used for protection of electronic components and assemblies against shock, vibration, moisture, ozone, dust, chemicals, and other environmental hazards by potting or encapsulation of the components and assemblies. The optical clarity of this silicone rubber suggests evaluation for applications such as potting solar cells for maximum light transmission and electronic assemblies where component identification is necessary or desirable. Key Features and Benefits: Convenient 10:1 mixing ratio for use in automatic dispensing or hand operations Low viscosity allows easy flow in and around complex parts, providing excellent electrical insulation and shock resistance Cure rate can be accelerated by heat Will cure in deep sections or enclosed assemblies without exotherm and with low shrinkage Chemical composition contains no solvents for ease of use on production lines Reversion resistance and hydrolytic stability permit use in high humidity environments at elevated temperatures Clarity permits visual inspection for easy identification and repair of encapsulated parts Retention of elastomeric properties at temperatures up to 204°C (400°F) |
技术参数 Technical Data | |||
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物理性能 PHYSICAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
收缩率 Shrinkage rate |
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MD MD |
0.20 | % | |
热性能 THERMAL |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
线性热膨胀系数 Linear coefficient of thermal expansion |
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MD MD |
2.7E-4 | 1/℃ | |
比热 specific heat |
1260 | J/kg/℃ | |
导热系数 Thermal conductivity coefficient |
0.19 | W/m/K | |
使用温度 Operating temperature |
-60 到 240 | ℃ | |
光学性能 optical performance |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
折射率 Refractive index |
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Uncured Properties Uncured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
重量混合比(PBW) Weight Mix Ratio (PBW) |
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Part A Part A |
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Part B Part B |
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密度 Density |
g/cm³ | ||
粘度 viscosity |
Pa·s | ||
固化时间 Curing time |
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125℃ 125℃ |
hr | ||
100℃ 100℃ |
hr | ||
65℃ 65℃ |
hr | ||
150℃ 150℃ |
hr | ||
25℃ 25℃ |
hr | ||
储存稳定性 storage stability |
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25 ℃ 25 ℃ |
min | ||
Cured Properties Cured Properties |
额定值 Nominal Value |
单位 Units |
测试方法 Test Method |
邵氏硬度 Shore hardness |
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邵氏 A Shaw's A |
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拉伸强度 tensile strength |
MPa | ||
拉伸应变 Tensile strain |
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断裂 fracture |
% | ||
耐电强度 Electrical strength |
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1.90 mm 1.90 mm |
kV/mm | ||
相对电容率 Relative permittivity |
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1 kHz 1 kHz |
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体积电阻率 Volume resistivity |
ohms·cm | ||
耗散因数 Dissipation factor |
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1 kHz 1 kHz |
备注 |
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1 一般属性:这些不能被视为规格。 |
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